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Category of Electronics

3-D with through-silicon via (TSV) technology

One of the hottest topics in the semiconductor industry today is 3-D with through-silicon via (TSV) technology.
While many research programs have been underway for years, commercial products have yet to be introduced.
What is driving the market for this new technology? What materials and processes will be used?
Will vias be formed during the wafer fabrication process or during IC packaging and assembly?
What are the limiting factors to the adoption of this new technology?
http://www.semiconductor.net/article/CA6445435.html

December 8, 2008 10:56 AM by bluedragon(Singapore / Malaysia)

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